Capability for S/S PCB
  1
Material thickness
0.8-1.6mm
  2
Copper thickness
35µ (1oz)
70µ (2oz)
  3
Minimum line width
0.17mm
0.17mm
  4
Minimum line spacing
0.17mm
0.17mm
  5
Smallest punched hole size
Paper: 0.7mm
Glass fabric: 0.8mm
  6
Hole size tolerance
0.05mm
  7
Min. height + width of legend:
1.3mm
0.3mm
  8
Spacing between PCB
V-cut:
0.3mm
Push back:
4.0mm
Break apart:
1.0mm
  9
Max punching surface
300mm x 500mm
 10
Max hole quantity for tooling
Paper: 3000 holes
CEM: 2000 holes
 11
Tooling lead time
1-2 weeks
 12
Electrical test
No. of Max. test point:
4096
 13
Special surface treatment
Golden plating:
0.5-1 µm
Carbon conductive ink:
As per customer request
OSP
Water Solution Flux
HASL
Lead free
Capability for D/S & Multi-layers PCB
    1
Min. line width
0.1mm (4 mil)
    2
Min. line spacing
0.1mm (4mil)
    3
Min. finished hole size
Mechanical drilling
0.25mm (10mil)
Laser drilling
0.10mm (04mil)
    4
Max. board size
533.4*609.6mm (21*24)
    5
Max. layer count
16 layer
    6
Min. thickness
4 layer
0.35mm (14mil)
6 layer
0.45mm (14mil)
8 layer
0.63mm (25mil)
10 layer
0.80mm (32mil)
    7
Max. thickness
4-12 layer
6 mm
    8
Min. SMD spacing
0.3mm (12mil)
    9
Registration between layer
0.1mm (04mil)
   10
Solder mask tolerance
0.075mm (03mil)